Method and structures for implementing impedance-controlled...

Details Method and structures for implementing impedance-controlled... Method and structures for implementing impedance-controlled...

2006-05-02

2006-05-02

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

Process

Plural joints

C228S245000, C228S246000, C228S056300

Reexamination Certificate

active

07036710

ABSTRACT:
A method and structures are provided for implementing an impedance-controlled coupled noise suppressor for a differential interface solder column array used to join a substrate to a circuit card. The impedance-controlled coupled noise suppressor structure includes a plurality of elongated through openings that are arranged in a predefined pattern with one or more of the through openings receiving a differential signal pair of solder columns. The elongated through openings have electrically conductive sidewalls and are electrically connected together. The predefined pattern of the elongated, electrically conductive through openings corresponds to a layout of solder columns. The solder columns are attached at opposite ends to a substrate and a circuit card. An electrical connection is provided between the impedance-controlled coupled noise suppressor structure and an image return current path of the circuit card.

REFERENCES:
patent: 3744129 (1973-07-01), Dewey, Jr.
patent: 5678287 (1997-10-01), Smith et al.
patent: 6414248 (2002-07-01), Sundstrom
patent: 6458623 (2002-10-01), Goldmann et al.
patent: 2003/0189083 (2003-10-01), Olsen

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