Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent
1998-03-12
2000-03-07
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Configuration or pattern of bonds
257773, 257774, 257763, 257764, 257765, H01L 2348, H01L 2352, H01L 2940
Patent
active
060344393
ABSTRACT:
A method for preventing bonding pads from peeling caused by plug process comprises the following steps. First, a substrate is prepared, and then a first conductor is formed on the substrate. Next, a dielectric layer is formed on the first conductor. After that, a big contact window and a plurality of small contact windows are formed on the dielectric layer, wherein the plurality of small contact windows are located around the big window, and the sizes of the big contact window and small contact windows are over 3 .mu.m. Subsequently, a metal plug layer is formed on the dielectric layer, big contact window and small contact windows. Thereafter, the metal plug layer is etched back to form metal spacers on the sidewalls of the big contact window and small contact windows. Finally, a second conductor is formed on the dielectric layer, big contact window, small contact windows and metal spacers. Since the second conductor is directly connected to the first conductor in the invention, bonding pads peeling can be thoroughly prevented during connecting between the bonding pads and outside pins.
REFERENCES:
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patent: 5248903 (1993-09-01), Heim
patent: 5270256 (1993-12-01), Bost et al.
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patent: 5686762 (1997-11-01), Langley
patent: 5841197 (1998-11-01), Adamic, Jr.
Chiang Shing-Shing
Lu Wen-Haw
Teng Kuo-Shi
Yung Hao-Chieh
Clark Jhihan B.
Saadat Mahshid
Winbond Electronics Corporation
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