Method and structure for passivating a semiconductor device

Metal treatment – Compositions – Heat treating

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357 2, 357 91, H01L 2126, H01L 21265

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active

042240840

ABSTRACT:
A method of passivating a silicon semiconductor device having at least one active component disposed in a crystalline region thereof comprises the steps of bombarding a surface of the crystalline region with ions to convert a part of the region adjacent the surface into an amorphous layer of graded crystallinity, and then exposing the amorphous layer to atomic hydrogen, whereby an integral layer of hydrogenated amorphous silicon is formed adjacent the crystalline region.

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