Method and structure for interfacing electronic devices

Details Method and structure for interfacing electronic devices Method and structure for interfacing electronic devices

2008-03-25

2008-03-25

Clark, S. V. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S107000

Reexamination Certificate

active

11523110

ABSTRACT:
Method and structure for optimizing and controlling diffusional creep at metal contact interfaces are disclosed. Embodiments of the invention accommodate height variations in adjacent contacts, decrease planarization uniformity requirements, and facilitate contact bonding at lower temperatures and pressures by employing shapes and materials that respond predictably to compressive interfacing loads.

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