Method and structure for implementing secure multichip...

Registers – Records – Conductive

Reexamination Certificate

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C235S494000

Reexamination Certificate

active

10907761

ABSTRACT:
A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier, one or more integrated circuit chips attached to the chip carrier, and a cap structure attached to the chip carrier, covering the one or more integrated circuit chips. A conductive grid structure is formed in the chip carrier and cap structure, the conductive structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction. The conductive grid structure is configured so as to detect an attempt to penetrate the IC module.

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KH Williams; Research Disclosure; Complete Module Ceramic Circuitized Cap.; Oct. 1987.
RF Kilburn and RF Olsen; Printed Circuit Module Assembly; IBM Technical Disclosure Bulletin; vol. 25, No. 4; Sep. 1982.

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