Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2006-04-18
2006-04-18
Vortman, Anatoly (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S717000, C257S717000, C257S713000, C257S707000
Reexamination Certificate
active
07031162
ABSTRACT:
Disclosed is a cooling structure which has individual spreaders or caps mounted on the chips. The thickness of the high power spreader or cap exceeds the thickness of the lower power spreaders to ensure that the high power spreader achieves the highest plane and mates to a heat sink with the smallest interface gap. The variable and higher gaps between the lower power spreaders and the heat sink base are accommodated by compressible thermal pad or grease materials.
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Arvelo Amilcar R.
Sikka Kamal Kumar
Toy Hilton T.
Cioffi, Esq. James J.
Gibb I.P. Law Firm LLC
International Business Machines - Corporation
Vortman Anatoly
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