Method and structure for contacting two adjacent GMR memory bit

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material

Reexamination Certificate

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C438S599000, C438S618000, C438S652000, C438S672000, C438S675000, C257SE21209, C257SE21658, C257SE21665, C257SE27006, C257SE27104

Reexamination Certificate

active

07396750

ABSTRACT:
A method and a structure are provided for improving the contact of two adjacent GMR memory bits. Two adjacent bit ends are connected by utilizing a single via.

REFERENCES:
patent: 6236079 (2001-05-01), Nitayama et al.
patent: 6376370 (2002-04-01), Farrar
patent: 2002/0173139 (2002-11-01), Kweon
patent: 2002/0195641 (2002-12-01), Fukuda et al.
patent: 2005/0099844 (2005-05-01), Witcraft et al.

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