Method and structure for attaching a semiconductor die to a lead

Details Method and structure for attaching a semiconductor die to a lead Method and structure for attaching a semiconductor die to a lead

1994-11-14

1996-08-20

Limanek, Robert P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257730, H01L 23495

Patent

active

055481604

ABSTRACT:
A structure for attaching a semiconductor wafer section to a lead frame comprises a carrier having an outside surface and an adhesive coating the carrier. Prior to use, the structure can be placed onto spools for easy shipment and storage.

REFERENCES:
patent: 5304842 (1994-04-01), Farnworth

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