Method and structure for attaching a semiconductor die to a lead

Details Method and structure for attaching a semiconductor die to a lead Method and structure for attaching a semiconductor die to a lead

1996-09-25

1999-08-24

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

438119, 438123, H01L 2144

Patent

active

059435577

ABSTRACT:
A semiconductor assembly comprises a semiconductor die having a circuit side with circuitry thereon, a lead frame, and an attachment structure for securing the die to the lead frame. The attachment structure comprises a carrier, an adhesive interposed between the carrier and the lead frame which attaches the carrier to the lead frame, and a paste interposed between the carrier and the circuit side of the die which attaches the carrier to the die. A method for attaching a semiconductor device to a lead frame comprises the steps of providing an attachment structure comprising a carrier having first and second sides and an adhesive on the first side of the carrier, the carrier attached to a lead frame by the adhesive. Next, a paste is dispensed on the second side of the carrier. A surface of the semiconductor die including circuitry is then contacted with the paste and the paste is cured.

REFERENCES:
patent: 5140404 (1992-08-01), Fogal et al.
patent: 5177032 (1993-01-01), Fogal et al.
patent: 5218229 (1993-06-01), Farnworth
patent: 5256598 (1993-10-01), Farnworth et al.
patent: 5286679 (1994-02-01), Farnworth et al.
patent: 5304842 (1994-04-01), Farnworth et al.
patent: 5477008 (1995-12-01), Pasqualoni et al.
patent: 5548091 (1996-08-01), DiStefano et al.

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