Method and structure for a pull test for controlled collapse...

Details Method and structure for a pull test for controlled collapse... Method and structure for a pull test for controlled collapse...

2007-06-22

2010-10-26

Caputo, Lisa M (Department: 2855)

Measuring and testing

Dynamometers

Responsive to force

Reexamination Certificate

active

07819027

ABSTRACT:
A tensile strength testing structure for controlled collapse chip connections (C4) disposed above a substrate includes: a fixture base configured for positioning substrates with C4; a top fixture plate with through hole channels; test pins for insertion through the through hole channels; wherein dimensional tolerances of the substrates are accounted for with openings on at least two sides of the fixture base for positioning the substrates, and during alignment of the top fixture plate through hole channels with the C4 prior to securing the top fixture plate to the fixture base; wherein the test pins are strain hardened metal wires; wherein lower ends of the test pins are joined to the C4 during a solder reflow process; and wherein distal ends of the test pins are pulled in a direction perpendicular to the testing structure to determine the tensile strength of the C4.

REFERENCES:
patent: 5175609 (1992-12-01), DiGiacomo et al.
patent: 5266522 (1993-11-01), DiGiacomo et al.
patent: 5442239 (1995-08-01), DiGiacomo et al.
patent: 5641913 (1997-06-01), Watanabe
patent: 5969262 (1999-10-01), Ino et al.
patent: 6117695 (2000-09-01), Murphy et al.
patent: 6359452 (2002-03-01), Mozzetta
patent: 6446311 (2002-09-01), Ueno
patent: 6523419 (2003-02-01), Nonaka et al.
patent: 6543419 (2003-04-01), Okamoto et al.
patent: 7462783 (2008-12-01), Howard et al.
Liu, “Reliability of Surface-mounted Anisotropically Conductive Adhesive Joints”, Journal of the Institute of Circuit Technology, 1993, vol. 19 No. 4, Wela Publications Ltd, British Isles.

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