Method and stencil for extruding material on a substrate

Details Method and stencil for extruding material on a substrate Method and stencil for extruding material on a substrate

1998-02-24

2000-07-18

Funk, Stephen R.

Printing

Stenciling

Stencils

101129, B41N 124

Patent

active

060891513

ABSTRACT:
A stencil for use in fabricating semiconductor devices is disclosed that has an aperture having a first portion extending from a first side thereof and a second portion extending from a second side thereof to minimize the shear stress between the material extruded therethrough and the stencil. The stencil allows for material to be extruded through the top of the stencil to the surface of the substrate and not contact the wall of the second portion of the aperture of the stencil. Since the material only contacts a small area of the first portion of the aperture near the top of the stencil, the material remains on the substrate and not in the aperture of the stencil.

REFERENCES:
patent: 4280888 (1981-07-01), Bush et al.
patent: 5359928 (1994-11-01), Blessington et al.
patent: 5361695 (1994-11-01), Takagi et al.
patent: 5373786 (1994-12-01), Umaba
patent: 5460316 (1995-10-01), Hefele
patent: 5478699 (1995-12-01), Blessington et al.
patent: 5553538 (1996-09-01), Freitag
patent: 5623872 (1997-04-01), Tomomatsu
patent: 5658827 (1997-08-01), Aulicino et al.
patent: 5669970 (1997-09-01), Balog et al.
patent: 5672542 (1997-09-01), Schwiebert et al.

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