Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate
2007-12-18
2007-12-18
Louie, Wai-Sing (Department: 2814)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With heat sink means
C257S707000, C257S713000, C257S719000
Reexamination Certificate
active
11138939
ABSTRACT:
A method and structure are provided for implementing enhanced cooling of a plurality of memory devices. The memory structure includes a stack of platters. A sub-plurality of memory devices is mounted on each platter. At least one connector is provided with each platter for connecting to the sub-plurality of memory devices. A heat sink is associated with the stack of platters for cooling the plurality of memory devices.
REFERENCES:
patent: 6861287 (2005-03-01), Farrar et al.
patent: 2002/0053726 (2002-05-01), Mikubo et al.
patent: 2005/0101056 (2005-05-01), Song et al.
patent: 2005/0133897 (2005-06-01), Baek et al.
patent: 2005/0141199 (2005-06-01), Chiou et al.
Bartley Gerald Keith
Borkenhagen John Michael
Cochran William Hugh
Hovis William Paul
Rudrud Paul
International Business Machines - Corporation
Louie Wai-Sing
Pennington Joan
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