Method and mold for manufacturing semiconductor device,...

Details Method and mold for manufacturing semiconductor device,... Method and mold for manufacturing semiconductor device,...

2005-04-19

2005-04-19

Graybill, David E. (Department: 2827)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S126000, C438S127000, C438S462000, C438S465000, C264S272170

Reexamination Certificate

active

06881611

ABSTRACT:
A method includes a resin sealing step of placing, in a cavity28of a mold20, a substrate16to which semiconductor elements11on which bumps12are arranged, a resin sealing step of supplying resin35to positions of the bumps12so that a resin layer13sealing the bumps12is formed, a protruding electrode exposing step of exposing at least ends of the bumps12sealed by the resin layer13so that ends of the bumps12are exposed from the resin layer13, and a separating step of cutting the substrate16together with the resin layer13so that the semiconductor elements11are separated from each other.

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