Method and means for improved heat removal in compact semiconduc

Details Method and means for improved heat removal in compact semiconduc Method and means for improved heat removal in compact semiconduc

1981-03-02

1984-05-22

James, Andrew J.

Heat exchange

With valve or movable deflector for heat exchange fluid flow

With by-pass of heat exchanger or heat exchanger section

165 80C, H01L 2504, F28F 700

Patent

active

044504721

ABSTRACT:
A semiconductor chip having improved heat dissipation capability. The back surface of a semiconductor chip is provided with microscopic channels defined by fins in intimate contact with the chip. A cover is affixed to the fins to enclose the channels for the laminar flow of coolant fluid. The chip can be mounted in a recessed portion of a dual in-line package (DIP) with conductive tubes integral with the package providing the flow of coolant. Advantageously, the tubes can function as power busses to the integrated circuit.

REFERENCES:
"Liquid Cooling of Integrated Circuit Chips" W. Anacker IBM Technical Disclosure Bulletin, vol. 20, No. 9, Feb. 1978, pp. 3742-3743.
"Integrally Grooved Semiconductor Chip and Heat Sink" A. H. Johnson IBM Technical Disclosure Bulletin, vol. 14, No. 5, Oct.1971, p. 1425.
"Heat Transfer from Silicon Chips and Wafers" R. W. Noth IBM Technical Disclosure Bulletin, vol. 17, No. 12, May 1975, p. 3544.
"Heat Exchange Element for Semiconductor Device Cooling" H. D. Edmonds and G. Markovits IBM Technical Disclosure Bulletin, vol. 23, No. 3, Aug. 1980, p. 1057.
"Grooved Substrate Boosts IC Cooling", Electronics, Aug. 25, 1982, p. 46.

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