Method and means for improved heat removal in compact semiconduc

Details Method and means for improved heat removal in compact semiconduc Method and means for improved heat removal in compact semiconduc

1984-03-07

1986-02-25

James, Andrew J.

357 81, H01L 2334, H01L 2346, H01L 2336

Patent

active

045730679

ABSTRACT:
A semiconductor chip having improved heat dissipation capability. The back surface of a semiconductor chip is provided with microscopic channels defined by fins in intimate contact with the chip. A cover is affixed to the fins to enclose the channels for the laminar flow of coolant fluid. The chip can be mounted in a recessed portion of a dual in-line package (DIP) with conductive tubes integral with the package providing the flow of coolant. Advantageously, the tubes can function as power busses to the integrated circuit.

REFERENCES:
patent: 4151548 (1979-04-01), Klein et al.
patent: 4188996 (1980-02-01), Pellant et al.
patent: 4450472 (1984-05-01), Tuckerman et al.
"Liquid Cooling of Integrated Circuit Chips"-Anacker-IBM Technical Disclosure Bulletin-vol. 20, No. 9, Feb. 1978, pp. 3742-3743.
"High Performance Heat Sinking for VLSI-Tuckerman et al.-IEEE Elect. Dev. Lett., vol. EDL-2, No. 5, May 1981, pp. 126-129.
"Limitations of Small Devices and Large Systems"-Keyes-VLSI Electronics: Microstructure Science, vol. 1-pp. 185-229, 1981.
"Physics and Modeling of Submicron Insulated-Gate Field-Effect Transistors"-Ferry-VLSI Electronics: Microstructure Science, vol. 1, 1981, pp. 231-232.
"Heat Transfer in Forced Convection Through Fins"-Keyes-IEEE Trans. on Devices-vol. ED-31, No. 9, Sep. 1984, pp. 1218-1221.
"Josephson Computer Technology: An IBM Research Project"-IBM J. Res. Develop., vol. 24-No. 2, Mar. 1980, pp. 107-112, Ancker.

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