Method and means for improved heat removal in compact semiconduc

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357 81, H01L 2334, H01L 2346, H01L 2336

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active

045730679

ABSTRACT:
A semiconductor chip having improved heat dissipation capability. The back surface of a semiconductor chip is provided with microscopic channels defined by fins in intimate contact with the chip. A cover is affixed to the fins to enclose the channels for the laminar flow of coolant fluid. The chip can be mounted in a recessed portion of a dual in-line package (DIP) with conductive tubes integral with the package providing the flow of coolant. Advantageously, the tubes can function as power busses to the integrated circuit.

REFERENCES:
patent: 4151548 (1979-04-01), Klein et al.
patent: 4188996 (1980-02-01), Pellant et al.
patent: 4450472 (1984-05-01), Tuckerman et al.
"Liquid Cooling of Integrated Circuit Chips"-Anacker-IBM Technical Disclosure Bulletin-vol. 20, No. 9, Feb. 1978, pp. 3742-3743.
"High Performance Heat Sinking for VLSI-Tuckerman et al.-IEEE Elect. Dev. Lett., vol. EDL-2, No. 5, May 1981, pp. 126-129.
"Limitations of Small Devices and Large Systems"-Keyes-VLSI Electronics: Microstructure Science, vol. 1-pp. 185-229, 1981.
"Physics and Modeling of Submicron Insulated-Gate Field-Effect Transistors"-Ferry-VLSI Electronics: Microstructure Science, vol. 1, 1981, pp. 231-232.
"Heat Transfer in Forced Convection Through Fins"-Keyes-IEEE Trans. on Devices-vol. ED-31, No. 9, Sep. 1984, pp. 1218-1221.
"Josephson Computer Technology: An IBM Research Project"-IBM J. Res. Develop., vol. 24-No. 2, Mar. 1980, pp. 107-112, Ancker.

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