Method and device of testing semiconductor integrated circuit ch

Details Method and device of testing semiconductor integrated circuit ch Method and device of testing semiconductor integrated circuit ch

1996-05-28

1998-09-29

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324760, 324752, G01R 3126

Patent

active

058150021

ABSTRACT:
A supersonic wave beam producing device projects a supersonic wave beam 5 on a semiconductor integrated circuit chip 2 while a voltage is supplied to a semiconductor integrated circuit in the chip from a constant voltage source 1. A current detecting device 7 detects a change of a current in the circuit while the chip is supplied with the supersonic wave beam. In this event, the constant voltage source may be omitted. A supersonic wave beam producing device may project a supersonic wave beam 5 on a semiconductor integrated circuit chip 2 while a current is supplied to a semiconductor integrated circuit. In this event, a voltage detecting device detects a change of a voltage between two ones of terminals of the circuit.

REFERENCES:
patent: 4736159 (1988-04-01), Shiragasawa et al.
patent: 4827212 (1989-05-01), Kamieniecki
patent: 4891584 (1990-01-01), Kamieniecki et al.
patent: 5087876 (1992-02-01), Reiss et al.
T. Koyama et al., "Bias-free evaluation technique for Al . . . high sensitive OBIC", Publication of Extended Absts. (The 55th Autumn Mtg, 1994), The Japan Society of Applied Physics, 22a-ZP 10, p. 586 (unavailable month).
K. Nikawa et al., "Novel Method for Defect Detection in Al Stripes by Means . . . and Detection of Changes in Electrical Resistance", Jpn. J. Appl. Phys., vol. 34, Part 1, No. 5A, May 1995, pp. 2260-2265.

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