Method and device for treating substrates

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

20429808, 20429823, 20429826, C23C 1454, C23C 1456

Patent

active

053002059

ABSTRACT:
The invention relates to a device for coating substrates by sputtering out of a plasma with at least one anode, one cathode, and an electric dc current voltage source, connectable pulse-wise to the anode/cathode path. The length of the voltage pulses and/or the interval between the pulses is regulatable.

REFERENCES:
patent: 4488956 (1984-12-01), Scherer et al.
patent: 4902394 (1990-02-01), Kenmotsu et al.
patent: 5015493 (1991-05-01), Gruen

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and device for treating substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and device for treating substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and device for treating substrates will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-509046

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.