Method and device for producing seamless ribbon and wire loops,

Metal tools and implements – making – Blank or process – Saws

Patent

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76DIG12, B23D 6500, B21B 500

Patent

active

052877744

ABSTRACT:
The precise cutting of thin wafers from blocks or rods of hard and brittle material by means of ribbon or wire saws requires a very high strength of the sawing ribbon material or sawing wire material. In the method according to the invention, seamless metal rings are cold-rolled to form ribbon loops, optionally divided to form narrower ribbon loops or to form wire loops and optionally provided with a cutting coating. In this way, extremely strong cutting tools can be obtained.

REFERENCES:
patent: 2029751 (1936-04-01), Adams
patent: 4176538 (1979-12-01), Kymmell et al.
"Das Fachwissen des Ingenieurs", vol. I/2, VEB Fachbuchverlag, Leipzig, 2206 (1965).

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