Method and device for precise alignment of semiconductor chips o

Details Method and device for precise alignment of semiconductor chips o Method and device for precise alignment of semiconductor chips o

1998-11-10

2000-10-03

Picardat, Kevin M.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438612, 438618, H01L 2144

Patent

active

06127254&

ABSTRACT:
A method and device are presented for precise alignment of a semiconductor chip on a substrate which, in a simple and cost-effective way, permit accurate alignment of individual chips on a substrate to be ensured.

REFERENCES:
patent: 5786260 (1998-07-01), Jang et al.
patent: 5888884 (1999-03-01), Wojnarowski
patent: 5924623 (1999-07-01), Kenney

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