Abrading – Precision device or process - or with condition responsive... – With indicating
Reexamination Certificate
2006-09-19
2006-09-19
Hail, III, Joseph J. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
With indicating
C451S009000, C451S036000, C451S041000, C451S056000, C451S060000, C451S287000, C451S288000, C451S443000, C451S444000, C451S446000
Reexamination Certificate
active
07108579
ABSTRACT:
The present invention relates to a polishing method for polishing a workpiece by pressing the workpiece, to be polished, against a fixed abrasive and bringing the workpiece into sliding contact with the fixed abrasive. The polishing method includes a first step of polishing the workpiece while supplying a polishing liquid which contains an anionic surface-active agent and does not contain abrasive particles, and a second step of polishing the workpiece while supplying a polishing liquid which contains a cationic surface-active agent and does not contain abrasive particles.
REFERENCES:
patent: 5948205 (1999-09-01), Kodera et al.
patent: 6200201 (2001-03-01), Ravkin et al.
patent: 6343978 (2002-02-01), Shimizu et al.
patent: 6565422 (2003-05-01), Homma et al.
patent: 6653242 (2003-11-01), Sun et al.
patent: 2002/0028581 (2002-03-01), Yasui et al.
patent: 1 050 369 (2000-11-01), None
patent: 1 077 108 (2001-02-01), None
patent: 2000-160136 (2000-06-01), None
patent: 2000-315665 (2000-11-01), None
patent: 2001-57352 (2001-02-01), None
patent: 2001-127022 (2001-05-01), None
patent: 2001-351888 (2001-12-01), None
patent: 2002-16025 (2002-01-01), None
patent: 2002-43256 (2002-02-01), None
patent: 2002-324771 (2002-11-01), None
patent: 2003-17447 (2003-01-01), None
patent: 02/066207 (2002-08-01), None
Akatsuka Tomohiko
Sasaki Tatsuya
Wada Yutaka
Ebara Corporation
Hail III Joseph J.
McDonald Shantese L.
Wenderoth , Lind & Ponack, L.L.P.
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