Method and device for detecting the end point of plasma process

Details Method and device for detecting the end point of plasma process Method and device for detecting the end point of plasma process

1994-08-23

1996-10-15

Dang, Thi

Etching a substrate: processes

Gas phase etching of substrate

With measuring, testing, or inspecting

156345, 356 72, 356316, G01N 2100

Patent

active

055651143

ABSTRACT:
This invention provides an end point detection method including the steps of sequentially detecting, when a process using a plasma is performed for an object to be processed, emission spectra in a specific wavelength band of an active species in the plasma by using a photodetector, calculating sum average values of emission intensities of the emission spectra, calculating the ratio or the difference between the sum average values to obtain a calculated value, and determining a point at which the calculated value exceeds a predetermined reference value as an end point of the process.

REFERENCES:
patent: 4289188 (1981-09-01), Mizutani et al.
patent: 4430151 (1984-02-01), Tsukada
patent: 4491499 (1985-01-01), Jerde et al.
patent: 4657620 (1987-04-01), Davis et al.
patent: 4948458 (1990-08-01), Ogle
patent: 5045149 (1991-09-01), Nulty
patent: 5097430 (1992-03-01), Birang
patent: 5160402 (1992-11-01), Cheng
patent: 5226967 (1993-07-01), Chen et al.
patent: 5241245 (1993-08-01), Barnes et al.
patent: 5290383 (1994-03-01), Koshimizu
patent: 5320704 (1994-06-01), Horioka et al.
patent: 5322590 (1994-06-01), Koshimizu

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