Method and device for controlled cleaving process

Details Method and device for controlled cleaving process Method and device for controlled cleaving process

2007-08-20

2008-12-30

Lindsay, Jr., Walter L (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S455000, C257SE21482

Reexamination Certificate

active

07470600

ABSTRACT:
A technique for forming a film of material (12) from a donor substrate (10). The technique has a step of forming a stressed region in a selected manner at a selected depth (20) underneath the surface. An energy source such as pressurized fluid is directed to a selected region of the donor substrate to initiate a controlled cleaving action of the substrate (10) at the selected depth (20), whereupon the cleaving action provides an expanding cleave front to free the donor material from a remaining portion of the donor substrate.

REFERENCES:
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patent: 6284631 (2001-09-01), Henley et al.
patent: 6291313 (2001-09-01), Henley et al.
patent: 6486041 (2002-11-01), Henley et al.
patent: 6790747 (2004-09-01), Henley et al.
patent: 2005/0070071 (2005-03-01), Henley et al.

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