Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Reexamination Certificate
2007-01-02
2007-01-02
McDonald, Rodney G. (Department: 1753)
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
C204S192150, C204S192170, C204S298060, C204S298080, C204S298090, C204S298120, C204S298190, C204S298240, C427S523000, C427S531000, C427S571000, C427S576000, C427S587000, C427S593000, C118S718000, C118S719000, C118S7230VE, C118S726000
Reexamination Certificate
active
10362585
ABSTRACT:
A method for the deposition of a metal layer on a substrate (1) uses a cold plasma inside an enclosure (7) heated to avoid the formation of a metal deposit at its surface. The enclosure has an inlet (21) and an outlet (22) for the substrate with a source of metal vapor between them, made up of an electrode to form a plasma (6) with the substrate or a separate electrically conducting element as a counter-electrode. The deposition metal is introduced in the liquid state in a retention tank (8) and is maintained as a liquid at an essentially constant level during the formation of the metal layer on the substrate. An Independent claim is included for the device used to put this method of coating a substrate into service.
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Brande Pierre Vanden
Weymeersch Alain
Browdy and Neimark PLLC
Cold Plasma Applications, CPA, SPRL
McDonald Rodney G.
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