Method and device for contacting semiconductor chips

Details Method and device for contacting semiconductor chips Method and device for contacting semiconductor chips

2004-08-28

2010-06-01

Landau, Matthew C (Department: 2813)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

Having specified scribe region structure

C438S464000, C257S797000

Reexamination Certificate

active

07727861

ABSTRACT:
The invention relates to a method and device that make it possible to increase the productivity of the chip bonding and the before and after working steps associated with the chip bonding. To this end, the invention provides a method for contacting semiconductor chips (3) on a metallic substrate (16), whereby an etch resist (27) is located at least on one substrate side, and semiconductor chips (3) are contacted on the contacting side (30) by means of flip-chip bonding processes, during which a contacting region (7) is created on the contacting side (30) of the substrate (16). A semiconductor chip (3) having two contact bumps (6) is contacted on said contacting region in such a manner that: a contact bump (6) is contacted on both sides of a structure line (35) or of a structure trench (13) dividing the contacting region (7), and; after the contacting, an underfilling of the chip (3) ensues after which an electrically insulating passage (14) is made in the contacting region (7), and a module (32), which supports the semiconductor chip (3), is removed from the substrate (16).

REFERENCES:
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patent: 6778282 (2004-08-01), Smets et al.
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patent: 2002/0027298 (2002-03-01), Sakamoto et al.
patent: 1 143 509 (2001-10-01), None
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patent: 02/071471 (2002-09-01), None
Aug. 3, 2006 International Search Report, PCT/DE2004/001900.

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