Method and device for cleaning substrates

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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134 1, 134 30, 134102, 134105, 156643, 156646, 156651, 156657, 156662, 156345, B44C 122, C03C 1500, C03C 2506, B08B 312

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active

048714160

ABSTRACT:
For cleaning substrates in a cleaning device, a reaction furnace of the cleaning device in which a substrate has been installed is evacuated and then supplied with a reducing gas, and a natural oxide film on the substrate is removed by heating it in an atmosphere of reducing gas, the reaction furnace is then is evacuated and a reactive gas is introduced into the reaction furnace, and contaminants on the substrate are removed by etching the substrate in the reactive gas that has been chemically activated by UV radiation.

REFERENCES:
patent: 4149905 (1979-04-01), Levinstein et al.
patent: 4260649 (1981-04-01), Dension et al.
patent: 4693779 (1987-09-01), Okuhira et al.
patent: 4718974 (1988-01-01), Minaee
patent: 4731158 (1988-03-01), Brannon
IBM Technical Disclosure Bulletin, vol. 27, No. 7B, Dec./1984.
Journal of the Electrochemical Society, vol. 134, No. 8A, Aug. 87.
Journal of Vacuum Science & Technology/A vol. 4, No. 3, May/June 1986.
VLSI Technology, p. 149 (Oxidation).

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