Method and compositions for achieving a kinetically controlled s

Details Method and compositions for achieving a kinetically controlled s Method and compositions for achieving a kinetically controlled s

1997-10-22

1999-11-23

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

361790, 361737, 438122, H01L 2348

Patent

active

059905603

ABSTRACT:
An improved method and composition for achieving a kinetically-controlled solder bond is disclosed having particular application to the fabrication of hybrid integrated circuits and optical subassemblies. The method involves the use of a solder layer, a quenching layer, and a control layer disposed between the solder layer and quenching layer, in which the control layer is advantageously comprised of a thin film of platinum. Additionally, a barrier layer, also preferably comprised of a thin film of platinum, is disposed between the solder layer and the parts to be bonded to prevent the oxidation of solder materials during the soldering process or later storage of the soldered parts.

REFERENCES:
patent: 5559817 (1996-09-01), Derkits, Jr. et al.

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