Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1997-12-19
2000-06-27
Gulakowski, Handy
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
216 69, 216 72, 216 75, H01L 21461
Patent
active
06080680&
ABSTRACT:
Methods and compositions for improving etch rate selectivity of photoresist to substrate material in a downstream microwave dry stripping process in the fabrication of semiconductor integrated (IC) circuits are provided. Significant improvement in selectivity is demonstrated with the addition of N.sub.2 to an etchant gas mixture of O.sub.2 and CF.sub.4.
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Hartney, M.A., Hess, D.W., Soane, D.S. "Oxygen Plasma Etching for Resist Stripping and Multilayer Lithography" J. Vac. Sci. Technology B7(1) (Jan./Feb. 1989): 1-13.
Lee Chang-hun
Yang Yun-Yen Jack
Gulakowski Handy
Lam Research Corporation
Olsen Allan
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