Method and composition for dry etching in semiconductor fabricat

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

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216 69, 216 72, 216 75, H01L 21461

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06080680&

ABSTRACT:
Methods and compositions for improving etch rate selectivity of photoresist to substrate material in a downstream microwave dry stripping process in the fabrication of semiconductor integrated (IC) circuits are provided. Significant improvement in selectivity is demonstrated with the addition of N.sub.2 to an etchant gas mixture of O.sub.2 and CF.sub.4.

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