Method and components for flip-chip bonding

Details Method and components for flip-chip bonding Method and components for flip-chip bonding

2005-09-20

2005-09-20

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Die bond

C257S778000, C438S108000, C438S119000

Reexamination Certificate

active

06946745

ABSTRACT:
In the forms of a flip-chip package in which the contact elements of the chip are ultrasonically welded to the contact elements of the substrate, either the chip or the substrate or both are provided, prior to juxtaposition, with a bonding material which can be ultrasonically activated. During the ultrasonic welding process in which the contact elements of the chip and substrate are bonded together, the bonding material provides an additional attachment between the chip and substrate and eliminates the need for underfilling.

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