Method and arrangement for treating a substrate with an...

Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...

Reexamination Certificate

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C216S058000, C216S059000, C438S706000, C438S710000, C315S111210, C427S099300, C427S569000

Reexamination Certificate

active

10198740

ABSTRACT:
Method for generating an atmospheric pressure glow plasma (APG), wherein said plasma is generated in a discharge space between a plurality of electrodes. A dielectric is present on at least one of said electrodes, said dielectric having a boundary surface with said plasma enabling interactions between said plasma and said surface. Said dielectric is arranged for releasing electrons contributing to said plasma from said surface by said interactions.

REFERENCES:
patent: 4396865 (1983-08-01), Britt et al.
patent: 5124173 (1992-06-01), Uchiyama et al.
patent: 5733610 (1998-03-01), Okazaki et al.
patent: 5982095 (1999-11-01), Jin et al.
patent: 6147452 (2000-11-01), Kunhardt et al.
patent: 6299948 (2001-10-01), Gherardi et al.
patent: 6411033 (2002-06-01), Mori et al.
patent: 6635996 (2003-10-01), Nakajima et al.

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