Optics: measuring and testing – Inspection of flaws or impurities – Surface condition
Reexamination Certificate
2006-03-14
2006-03-14
Lauchman, Layla G. (Department: 2877)
Optics: measuring and testing
Inspection of flaws or impurities
Surface condition
C250S559440
Reexamination Certificate
active
07012684
ABSTRACT:
The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. In one embodiment, a substrate process inspection system comprises a plurality of optical inspection systems each configured to perform an optical inspection process at a first degree of optical resolution and an inspection platform configured to perform an optical inspection process at a second degree of optical resolution. The plurality of optical inspection systems each comprises a transmitter unit and a receiver unit. The substrate process inspection system further comprises a controller system connected to the plurality of optical inspection systems and the inspection platform. The controller system is configured to (i) process optical signal information indicative of a topographical condition on a substrate inspected by at least one of the plurality of optical inspection systems and (ii) in response to the topographical condition, cause execution of one of a plurality of subsequent substrate handling steps. In one embodiment, a first substrate handling step comprises transferring the substrate to the inspection platform for further optical inspection.
REFERENCES:
patent: 4441124 (1984-04-01), Heebner et al.
patent: 4449818 (1984-05-01), Yamaguchi et al.
patent: 4499595 (1985-02-01), Masaitis et al.
patent: 4626101 (1986-12-01), Ogawa et al.
patent: 4644172 (1987-02-01), Sandland et al.
patent: 4772126 (1988-09-01), Allemand et al.
patent: 4893932 (1990-01-01), Knollenberg
patent: 4898471 (1990-02-01), Vaught et al.
patent: 4920385 (1990-04-01), Clarke et al.
patent: 4941980 (1990-07-01), Halavee et al.
patent: 4969748 (1990-11-01), Crowley et al.
patent: 4977330 (1990-12-01), Batchelder et al.
patent: 4989973 (1991-02-01), Noso et al.
patent: 5058178 (1991-10-01), Ray
patent: 5120034 (1992-06-01), Van Engelen et al.
patent: 5177559 (1993-01-01), Batchelder et al.
patent: 5186718 (1993-02-01), Tepman et al.
patent: 5233191 (1993-08-01), Noguchi et al.
patent: 5274434 (1993-12-01), Morioka et al.
patent: 5308447 (1994-05-01), Lewis et al.
patent: 5310410 (1994-05-01), Begin et al.
patent: 5317656 (1994-05-01), Moslehi et al.
patent: 5416594 (1995-05-01), Gross et al.
patent: 5444265 (1995-08-01), Hamilton
patent: 5463459 (1995-10-01), Morioka et al.
patent: 5465152 (1995-11-01), Bilodeau et al.
patent: 5479252 (1995-12-01), Worster et al.
patent: 5483138 (1996-01-01), Shmookler et al.
patent: 5486919 (1996-01-01), Tsuji et al.
patent: 5563798 (1996-10-01), Berken et al.
patent: 5637881 (1997-06-01), Burghard et al.
patent: 5644393 (1997-07-01), Nakamura et al.
patent: 5646725 (1997-07-01), Hagiwara
patent: 5659172 (1997-08-01), Wagner et al.
patent: 5663569 (1997-09-01), Hayano
patent: 5672091 (1997-09-01), Takahashi et al.
patent: 5694214 (1997-12-01), Watanabe et al.
patent: 5699447 (1997-12-01), Alumot et al.
patent: 5737072 (1998-04-01), Emery et al.
patent: 5748305 (1998-05-01), Shimono et al.
patent: 5774222 (1998-06-01), Maeda et al.
patent: 5781230 (1998-07-01), Nguyen et al.
patent: 5797317 (1998-08-01), Lahat et al.
patent: 5801824 (1998-09-01), Henley
patent: 5805278 (1998-09-01), Danko
patent: 5808735 (1998-09-01), Lee et al.
patent: 5818576 (1998-10-01), Morishige et al.
patent: 5822213 (1998-10-01), Huynh
patent: 5834758 (1998-11-01), Trulson et al.
patent: 5861952 (1999-01-01), Tsuji et al.
patent: 5864394 (1999-01-01), Jordan, III et al.
patent: 5883710 (1999-03-01), Nikoonahad et al.
patent: 5889593 (1999-03-01), Bareket
patent: 5900633 (1999-05-01), Solomon et al.
patent: 5903342 (1999-05-01), Yatsugake et al.
patent: 5909276 (1999-06-01), Kinney et al.
patent: 5912732 (1999-06-01), Sekine
patent: 5940175 (1999-08-01), Sun
patent: 5963315 (1999-10-01), Hiatt et al.
patent: 6012966 (2000-01-01), Ban et al.
patent: 6020957 (2000-02-01), Rosengaus et al.
patent: 6021380 (2000-02-01), Fredriksen et al.
patent: 6045434 (2000-04-01), Fisher et al.
patent: 6166801 (2000-12-01), Dishon et al.
patent: 6178257 (2001-01-01), Alumot et al.
patent: 6185322 (2001-02-01), Ishikawa et al.
patent: 6188564 (2001-02-01), Hao
patent: 6236903 (2001-05-01), Kim et al.
patent: 6320402 (2001-11-01), Phan et al.
patent: 0 206 709 (1986-12-01), None
patent: 0 398 781 (1990-11-01), None
patent: 0 638 801 (1995-02-01), None
patent: 0 821 085 (1998-01-01), None
patent: 1 030 173 (2000-08-01), None
patent: 1030173 (2000-08-01), None
patent: 1 083 424 (2001-03-01), None
patent: 09196859 (1997-07-01), None
patent: 97/19416 (1997-05-01), None
patent: 99/00661 (1999-01-01), None
patent: 99/49500 (1999-09-01), None
patent: WO 99/56113 (1999-11-01), None
Written Opinion (Form PCT/IPEA/408), dated Jan. 10, 2003 for PCT/US01/42470.
Written Opinion for PCT/US01/31293, dated Dec. 31, 2002.
International Search Report for PCT/US01/42483, dated Oct. 14, 2002.
International Search Report for PCT/US01/31079, dated Jun. 24, 2002.
U.S. Appl. No. 09/173,669,Detection of Wafer Fragments in a Wafer Processing Apparatus, filed Oct. 15, 1998.
European Search Report Dated Dec. 12, 2000.
Search Report from EPO Appl. No. 00307704.7, dated Mar. 1, 2001.
International Search Report for PCT/US01/31426, dated Nov. 27, 2002.
International Search Report for PCT/US01/31094, dated Nov. 27, 2002.
PCT Written Opinion dated Apr. 1, 2004; Application No. PCT/US01/42483.
European Examination Report dated Feb. 19, 2004; Application No. 00307704.7.
PCT International Preliminary Examination Report, May 30, 2003.
Written Opinion, International Application No. PCT/US01/31094, Jul. 11, 2003.
Applied Materials Inc.
Lauchman Layla G.
Patterson & Sheridan
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