Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-01-30
2007-01-30
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C257SE21078
Reexamination Certificate
active
11195434
ABSTRACT:
The present invention is an electronic interconnect comprising a bond pad consisting essentially of aluminum and copper and configured for use in semiconductor electronic devices to couple a bond wire to an integrated circuit package. The bond pad has an oxide coating residing on at least a topmost surface of the bond pad. The oxide coating consists essentially of aluminum, copper, and oxygen. Therefore, the bond pad has little, if any, naturally occurring corrosion products such as hydrated aluminum hydroxide (Al(OH)3) and/or Al2Cu particles. Al(OH)3films and Al2Cu particles have been shown to form on aluminum copper bond pads, preventing effective wire-bonding.
REFERENCES:
patent: 4478915 (1984-10-01), Poss et al.
patent: 6533966 (2003-03-01), Nonninger et al.
patent: 6599767 (2003-07-01), Li
patent: 7098591 (2006-08-01), Zhu et al.
patent: 2002/0081776 (2002-06-01), Tellkamp
patent: 2002/0121703 (2002-09-01), Toyoda et al.
R. Serna et al., “Effect of oxygen pressure on the optical and structural properties of Cu:Al2O3 nanocomposit film” Physical Review B, vol. 66, pp. 205402-1 to 205401-10, American Physical Society, Year 2002.
S. Thomas et al., “Micro-Corrosion of Al-Cu Bonding Pads”, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Jun. 1987, vol. CHMT-10, No. 2, pp. 252-257.
Printout: Galvanic Voids, Semiconductor Reliability News, Apr. 1992, 1 page.
Atmel Corporation
Coleman W. David
Schneck Thomas
Schneck & Schneck
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