Cleaning and liquid contact with solids – Apparatus – With plural means for supplying or applying different fluids...
Reexamination Certificate
2007-01-23
2007-01-23
Kornakov, M. (Department: 1746)
Cleaning and liquid contact with solids
Apparatus
With plural means for supplying or applying different fluids...
C134S184000, C134S200000, C134S902000
Reexamination Certificate
active
10326348
ABSTRACT:
An apparatus and a method is provided for decoupling a cavitation in a liquid from an acoustic energy used to induce the cavitation. Broadly speaking, a pressure adjustment is used to control an acoustically induced cavitation in a liquid contained within a wafer cleaning apparatus, wherein the cavitation is defined by an amount and a size of gas bubbles. An increase in a pressure within the wafer cleaning apparatus results in a suppression of the cavitation. Conversely, a decrease in the pressure within the wafer cleaning apparatus results in an enhancement of the cavitation. Thus, independent control of the cavitation is provided without regard to the acoustic energy or a chemistry of the liquid. Controlling the cavitation allows for a safe and efficient wafer cleaning operation that can be customized to address specific requirements dictated by a particular wafer configuration.
REFERENCES:
patent: 5143103 (1992-09-01), Basso et al.
patent: 5377709 (1995-01-01), Shibano
patent: 2003/0062071 (2003-04-01), Sorbo et al.
patent: 2004/0089324 (2004-05-01), Gray et al.
Boyd John M.
Ravkin Michael
Redecker Fred C.
Kornakov M.
Lam Research Corporation
Martine & Penilla & Gencarella LLP
LandOfFree
Method and apparatus to decouple power and cavitation for... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus to decouple power and cavitation for..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus to decouple power and cavitation for... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3815815