Method and apparatus to control mounting pressure of semiconduct

Details Method and apparatus to control mounting pressure of semiconduct Method and apparatus to control mounting pressure of semiconduct

1998-11-06

2000-08-22

Rachuba, M.

Abrading

Precision device or process - or with condition responsive...

With indicating

451 9, 451 59, 125 28, B24B 4900

Patent

active

061063657

ABSTRACT:
A method and apparatus for controlling a mounting pressure for semiconductor ingots provide appropriate mounting pressure so that a high quality bond is formed between a semiconductor ingot and a mounting beam. The pressure between the semiconductor ingot and the mounting beam can be directly determined, but other indications representative of the pressure can be also used to control the mounting pressure.

REFERENCES:
patent: 4565094 (1986-01-01), Sedgewick
patent: 4667650 (1987-05-01), Girard et al.
patent: 4773951 (1988-09-01), Moffatt et al.
patent: 4852434 (1989-08-01), Bald
patent: 4897141 (1990-01-01), Girard
patent: 4949700 (1990-08-01), Ebashi
patent: 5720271 (1998-02-01), Hauser
patent: 5735258 (1998-04-01), Okuno et al.
patent: 5839424 (1998-11-01), Hauser
patent: 5857454 (1999-01-01), Shibaoka
patent: 5878737 (1999-03-01), Hodsden
patent: 5896851 (1999-04-01), Katamachi et al.

Affiliated with

Also associated with

Rating

Method and apparatus to control mounting pressure of semiconduct does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus to control mounting pressure of semiconduct, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus to control mounting pressure of semiconduct will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-574272