Method and apparatus providing integrated circuit having...

Details Method and apparatus providing integrated circuit having... Method and apparatus providing integrated circuit having...

2007-03-27

2010-10-12

Pham, Thanh V (Department: 2894)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S621000

Reexamination Certificate

active

07812461

ABSTRACT:
A method of making a semiconductor die includes forming a trench around a conductive stud extending from the first side to a second side of a substrate to expose a portion of the stud and then forming a conductive layer inside the trench and in electrical contact with the stud.

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