Method and apparatus providing fine alignment of a structure...

Details Method and apparatus providing fine alignment of a structure... Method and apparatus providing fine alignment of a structure...

2009-08-05

2010-12-28

Ward, Jessica L (Department: 1793)

Metal fusion bonding

Process

Plural heat applying

C228S233100, C228S102000, C228S103000

Reexamination Certificate

active

07857195

ABSTRACT:
A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

REFERENCES:
patent: 5244143 (1993-09-01), Ference et al.
patent: 5569960 (1996-10-01), Kumazawa et al.
patent: 6131795 (2000-10-01), Sato
patent: 6149122 (2000-11-01), Berger et al.
patent: 6294745 (2001-09-01), Gruber
patent: 6355298 (2002-03-01), Wah et al.
patent: 6666368 (2003-12-01), Rinne
Lee, S. H.-K., et al., “The Effects of the Bondpad and Soldershpere Sizes on the Ball-Shear Strength of fpBGA Packages”, 7 pgs.
“Solder for microwave assemblies”, Internet article, Soldering Basics—Microwave Encyclopedia—Microwaves101.com, Jun. 14, 2006, 3 pgs.
“Database for Solder Properties with Emphasis on New Lead-free Solders, Properties of Lead-Free Solders”, Release 4.0, Internet article, part 1- Mechanical Properties, National Institute of Standards & Technology and Colorado School of Mines Feb. 11, 2002, 2 pgs.
“Table 2.2.19. Lead-Free Solder Alloys, Solidus and Liquidus Temperatures, Coefficient of Thermal Expansion, Surface Tension, and Electrical Resistivity”, Internet article, Part 2—Thermal properties, Jun. 14, 2006, 3 pgs.
“Polymer-Core Solder Balls: An Alternative to Solid Solder Balls?”, Internet article, www.circuitreecom, Jun. 14, 2006, 3 pgs.

Affiliated with

Also associated with

Rating

Method and apparatus providing fine alignment of a structure... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus providing fine alignment of a structure..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus providing fine alignment of a structure... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4224842