Method and apparatus providing fine alignment of a structure...

Metal fusion bonding – Process – Plural heat applying

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C228S233100, C228S102000, C228S103000

Reexamination Certificate

active

07841510

ABSTRACT:
A method for fine positioning a component through the use of fusible elements having two or more melting points so as to establish intermediate displacements between totally melted fusible elements and unmelted fusible elements. Because of the use of non-eutectic fusible materials, fine adjustments in the displacement may be achieved.

REFERENCES:
patent: 5244143 (1993-09-01), Ference et al.
patent: 5569960 (1996-10-01), Kumazawa et al.
patent: 6131795 (2000-10-01), Sato
patent: 6149122 (2000-11-01), Berger et al.
patent: 6294745 (2001-09-01), Gruber
patent: 6666368 (2003-12-01), Rinne
patent: 2006/0124705 (2006-06-01), Kuczynski et al.
Lee, S. H.-K., et al., “The Effects of the Bondpad and Soldershpere Sizes on the Ball-Shear Strength of fpBGA Packages”, 7 pgs.
“Solder for microwave assemblies”, Internet article, Soldering Basics—Microwave Encyclopedia—Microwaves101.com, Jun. 14, 2006, 3 pgs.
“Database for Solder Properties with Emphasis on New Lead-free Solders, Properties of Lead-Free Solders”, Release 4.0, Internet article, part 1- Mechanical Properties, National Institute of Standards & Technology and Colorado School of Mines, Feb. 11, 2002, 2 pgs.
“Table 2.2.19. Lead-Free Solder Alloys, Solidus and Liquidus Temperatures, Coefficient of Thermal Expansion, Surface Tension, and Electrical Resistivity”, Internet article, Part 2—Thermal properties, Jun. 14, 2006, 3 pgs.
“Polymer-Core Solder Balls: An Alternative to Solid Solder Balls?”, Internet article, www.circuitreecom, Jun. 14, 2006, 3 pgs.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus providing fine alignment of a structure... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus providing fine alignment of a structure..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus providing fine alignment of a structure... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4173160

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.