Method and apparatus providing a circuit edit structure through

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

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438 4, 438 14, 216 58, 216 59, H01L 2358

Patent

active

061538914

ABSTRACT:
A method and an apparatus providing a circuit edit structure to an integrated circuit enabling circuit edits to be performed through the back side of an integrated circuit die. In one embodiment, a passive diffusion is disposed in the substrate of a flip-chip packaged integrated circuit die. A plurality of contacts couple the passive diffusion to a signal line disposed in a dielectric isolation layer of the integrated circuit die. In another embodiment, the signal line includes an uninterrupted length of approximately 3.0 microns beneath a field oxide region in the integrated circuit die, which provides a circuit edit cut location. The passive diffusion and circuit edit cut locations may be accessed through the back side of the flip-chip packaged integrated circuit, which enable circuit edits to be performed on the flip-chip packaged integrated circuit.

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