Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate
2009-02-23
2010-10-26
Nguyen, Ha Tran T (Department: 2829)
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
C324S765010
Reexamination Certificate
active
07821281
ABSTRACT:
Method and apparatus of testing die to die interconnection for system in package (SiP). For testing a die to die interconnection connected between two pads of two dice, an IO buffer, e.g., a bi-directional IO buffer, in one of the two dice coupled to one of the two pads is arranged. An oscillating feedback is formed between an output port and an input port of the IO buffer, such that a state, e.g., an open state, a short state or a normal state of the die to die interconnection is tested according to a timing characteristic, e.g., a frequency, of a signal of the IO buffer.
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Faraday Technology Corp.
Hsu Winston
Isla Rodas Richard
Margo Scott
Nguyen Ha Tran T
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