Method and apparatus of monitoring polishing pad wear during pro

Details Method and apparatus of monitoring polishing pad wear during pro Method and apparatus of monitoring polishing pad wear during pro

1997-11-10

2000-04-04

Eley, Timothy V.

Abrading

Precision device or process - or with condition responsive...

By optical sensor

451 9, 451 10, 451 21, 451 56, 451288, 451290, B24B 4900

Patent

active

060454342

ABSTRACT:
A method and apparatus for monitoring polishing pad wear during processing is developed to extend the pad's useful life, and maintain pad uniformity. This is accomplished in the present invention by measuring and monitoring the diminished pad thickness using a non-intrusive measurement system, and creating a closed-loop system for adjusting the chemical-mechanical polishing tool process parameters. The non-intrusive measurement system consists of an interferometer measurement technique utilizing ultrasound or electromagnetic radiation transmitters and receivers aligned to cover any portion of the radial length of a polishing pad surface. The measurement system is sensitive to relative changes in pad thickness for uniformity, and to abrupt changes such as detecting wafer detachment from the CMP wafer carrier.

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