Fishing – trapping – and vermin destroying
Patent
1990-06-12
1992-11-10
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437 8, 437935, 437979, 427 96, H01L 2100
Patent
active
051622408
ABSTRACT:
A thick and thin film hybrid multilayer wiring substrate includes an adjustment layer provided between a thick film circuit and a thin film circuit in order to adjust positions of the thick film circuit and the thin film circuit with high integration and large area of the thick and thin film hybrid substrate. The adjustment layer is formed using a direct printing process in accordance with dispersion of the shape of the thick film circuit substrate to absorb the dispersion of the substrate. Further, in order to absorb dispersion of contraction of the thick film substrate due to sintering, a position of a mark provided on the substrate is detected by an electron beam and thereafter a connection pattern is formed to be connected to a regular pattern.
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Arima Hideo
Fukuhara Satoru
Inoue Takashi
Kuroda Katsuhiro
Matsuoka Genya
Hearn Brian E.
Hitachi , Ltd.
Picardat Kevin M.
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