Method and apparatus of coupling a die to a lead frame with a ta

Details Method and apparatus of coupling a die to a lead frame with a ta Method and apparatus of coupling a die to a lead frame with a ta

1993-04-07

1994-09-06

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361723, 361748, 361772, 361807, 174 524, 174255, 257690, H05K 100

Patent

active

053453638

ABSTRACT:
An integrated circuit package which utilizes a standard TAB tape that can couple a lead frame to one of a number of integrated circuit dies that have different outer dimensions. The TAB tape includes a sheet of polyimide which supports a plurality of conductive leads. The sheet has a rectangular center opening which provides clearance for the IC die. Adjacent to each edge of the center opening are a plurality of equally spaced contact openings which expose portions of the leads. The leads are coupled to the integrated circuit by attaching the contact portions to the surface pads of the die. The contact openings are located at various distances from the center opening so that the tape can accommodate different die sizes. The leads of the TAB tape are also attached to a lead frame through lead frame openings in the polyimide.

REFERENCES:
patent: 5177863 (1993-01-01), Lam

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