Method and apparatus for writing a line on a patterned substrate

Electric heating – Metal heating – By arc

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

21912176, 21912184, 346762, 427 531, B23K 2600

Patent

active

048734136

ABSTRACT:
Method and apparatus for writing a line on a patterned substrate in which a direct writing of a CVD line is performed on at least two of patterned films on a substrate in accordance with the thermal decomposition of a CVD raw material gas which is resulted from the radiation of a laser beam. The laser beam is controlled in its power dependent on the difference between thermal conductivities of the at least two of patterned films to avoid a disconnection of the CVD line, the occurrence of thinner portion thereof and so on.

REFERENCES:
patent: 4569855 (1986-02-01), Matsuda et al.
patent: 4595601 (1986-06-01), Horioka et al.
patent: 4608117 (1986-08-01), Ehrlich et al.
patent: 4668304 (1987-05-01), Schachameyer et al.
patent: 4685976 (1987-08-01), Schachameyer et al.
patent: 4778693 (1988-10-01), Drozdowicz et al.
D. J. Ehrlich et al., "Laser Microchemical Techniques for Reversible Restruting of Gate-Array Prototype Circuits", IEEE Electron Device Letters, vol. EDL-5, No. 2, pp. 32-35, Feb. 1984.
D. J. Ehrlich et al., "Laser Microreaction for Deposition of Doped Silicon Films", Appl. Phys. Lett. 39(12), Dec. 1981, pp. 957-959.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for writing a line on a patterned substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for writing a line on a patterned substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for writing a line on a patterned substrate will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1959036

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.