Method and apparatus for wire bonding semiconductor dice to a le

Details Method and apparatus for wire bonding semiconductor dice to a le Method and apparatus for wire bonding semiconductor dice to a le

1993-05-03

1994-06-21

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

228 45, H01L 2160

Patent

active

053222075

ABSTRACT:
A method and apparatus for wire bonding bond pads formed on semiconductor dice to the lead fingers of a semiconductor leadframe are provided. Using an automated wire bonding apparatus two (or more) adjacent dice attached to the leadframe are wire bonded using a single indexing step for the leadframe. The wire bonding apparatus includes a heat block for heating the two adjacent dice, and a clamp for clamping the two adjacent dice to the heat block for wire bonding. A bonding tool of the wire bonding apparatus is moved to successively wire bond the two adjacent dice. The method of the invention is suitable for DIP, ZIP, SOJ, TSOP, PLCC, SOIC, PQFP, or IDF semiconductor packages.

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