Method and apparatus for wet chemical processing of semiconducto

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156345, 156662, B44C 122, H01L 21306

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active

052756904

ABSTRACT:
A semiconductor wafer (52) or other object is retained in a cell (50) such that a thin space (60) having a laterally spaced inlet (62) and outlet (64) is provided above the wafer surface (52a). A plurality of chemicals including solvents, etchants, etc. are provided in individual pressurized containers (18,20,22,24,28,44). A valve (42) connects a selected container (18,20,22,24,28,44) to the inlet (62) for a length of time sufficient for the respective chemical to fill the space (60), and also connects the outlet (64) to an individual receptacle (26,30) for the chemical. The valve (42) then disconnects the container (18,20,22,24,28,44) and receptacle (26,30) from the inlet (62) and outlet (64) and traps the chemical in the space (60) for a length of time sufficient for the chemical to react with the wafer surface (52a). This operation is repeated such that the wafer surface (52a) is exposed to a number of fresh volumes of the chemical in a pulsating manner sufficient to perform a desired processing operation, and used volumes of the chemical are discharged from the space (60) into and captured by the receptacle (26,30). Additional containers (32) may be provided to enable a non-reactive gas, cleaning agent, etc. to be passed through the space (60) to dry and sanitize the surface (52a) and purge the flow passageways of used chemical prior to processing with another chemical.

REFERENCES:
patent: 3664354 (1972-05-01), Minbiole et al.
patent: 4376009 (1983-03-01), Kunz
patent: 4482425 (1984-11-01), Battey
patent: 4544446 (1985-10-01), Cady

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