Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2008-04-01
2008-04-01
Chiang, Jack (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000
Reexamination Certificate
active
11198470
ABSTRACT:
A method and apparatus for using full-chip thermal analysis of semiconductor chip designs to compute thermal conductivity is disclosed. One embodiment of a novel method for analyzing the conductivity of a semiconductor chip design that comprises a plurality of physical layers includes defining at least one thermal layer within the plurality of physical layers, where the thermal layer(s) represents a variance in thermal conductivity relative to a remainder of the semiconductor chip design, and computing a thermal conductivity of the thermal layer(s). As the thermal layer(s) represents variances in thermal conductivity over the semiconductor chip design, the thermal layer(s) does not necessarily correspond one-to-one to the physical layers of the semiconductor chip design. Thus, the thermal conductivities within the semiconductor chip design can be computed from the thermal layers.
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Chandra Rajit
Srinivasan Adi
Chiang Jack
Gradient Design Automation Inc.
Patterson & Sheridan LLP
Tat Binh
Tong, Esq. Kin-Wah
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