Method and apparatus for using a pressure control system to...

Details Method and apparatus for using a pressure control system to... Method and apparatus for using a pressure control system to...

2004-06-16

2008-09-30

Nghiem, Michael P (Department: 2863)

Data processing: measuring, calibrating, or testing

Measurement system

Performance or efficiency evaluation

Reexamination Certificate

active

07430496

ABSTRACT:
A method and apparatus is presented for using a pressure control system to monitor a plasma processing system. By monitoring variations in the state of the pressure control system, a fault condition, an erroneous fault condition, or a service condition can be detected. For example, the service condition can include monitoring the accumulation of residue between successive preventative maintenance events.

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patent: 6843264 (2005-01-01), Chang et al.
patent: 7217942 (2007-05-01), Tanaka
patent: 2002/0182878 (2002-12-01), Hirose et al.
patent: 2005/0115824 (2005-06-01), Donohue et al.
patent: 2006/0048891 (2006-03-01), Yue et al.

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