Method and apparatus for treating a semi-conductor substrate

Details Method and apparatus for treating a semi-conductor substrate Method and apparatus for treating a semi-conductor substrate

2011-04-12

2011-04-12

Maldonado, Julio J (Department: 2823)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S782000, C438S790000, C257SE21262, C257SE21266, C257SE21277

Reexamination Certificate

active

07923383

ABSTRACT:
This invention relates to a method of treating a semiconductor wafer and in particular, but not exclusively, to planarisation. The method consists of depositing a liquid short-chain polymer formed from a silicon containing bas or vapour. Subsequently water and OH are removed and the layer is stabilised.

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