Method and apparatus for transport and processing of substrate w

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156345, 156655, 156668, 430329, B29C 1708, B44C 122, C03C 1500, C03C 2506

Patent

active

046004718

ABSTRACT:
Method of transporting and processing substrates with developing agent within a confined passage. Pressurized fluid medium is supplied and discharged on both sides of the substrate via sequentially located fluid medium supply and discharge channels intersecting the top and bottom of the passage, such that the moving fluid medium cushions the substrate and both sides of the substrate remain free of the passage. Developing agent is introduced via a developing agent supply channel intersecting the passage.

REFERENCES:
patent: 2848820 (1958-08-01), Wallin et al.
patent: 3645581 (1972-02-01), Lasch et al.
patent: 3704685 (1972-12-01), Neumann et al.
patent: 3731823 (1973-05-01), Goth
patent: 4081201 (1978-03-01), Hassan et al.
patent: 4226526 (1980-10-01), Spence-Bate et al.
patent: 4278366 (1981-07-01), Loveless et al.
patent: 4292745 (1981-10-01), Caratsch
patent: 4341592 (1982-07-01), Shortes et al.
patent: 4406388 (1983-09-01), Takashi et al.
patent: 4480777 (1984-11-01), Suzuki et al.

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