Method and apparatus for thermally insulating a wafer support

Details Method and apparatus for thermally insulating a wafer support Method and apparatus for thermally insulating a wafer support

1992-12-24

1994-09-06

Chambers, A. Michael

Heat exchange

With retainer for removable article

Electrical component

118725, 118728, F28F 700

Patent

active

053439384

ABSTRACT:
Apparatus and method for reducing heat transfer from a motor to a wafer in a spin-on coating apparatus. The interior of the wafer chuck or spindle is provided with a gap, chamber or void that is either evacuated or is filled with a selected gas or other thermal barrier having low thermal conductivity compared to the wafer chuck material or the spindle material. Optionally, the wafer chuck or the spindle may be provided with a plurality of apertures that allow the gas in the gap to flow to a region outside the wafer chuck or the spindle.

REFERENCES:
patent: 4909314 (1990-03-01), Lamond, Jr
patent: 4911812 (1990-03-01), Kudo et al.
patent: 4966669 (1990-10-01), Sadamori et al.
patent: 4969511 (1990-11-01), Person
patent: 4990374 (1991-02-01), Keller et al.
patent: 5096536 (1992-03-01), Cathey, Jr.

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