Method and apparatus for thermally actuated self testing of sili

Measuring and testing – Instrument proving or calibrating – Volume of flow – speed of flow – volume rate of flow – or mass...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

73 1D, G01P 2100

Patent

active

053557123

ABSTRACT:
The present invention discloses a method and apparatus for testing the operational capability of flexure area equipped sensors especially those made of micromachined silicon. A thermal actuator beam is provided to bridge the structures which are joined by the flexure area. During the test, the beam's temperature is changed relative to that of the flexure area so as to provide a differential expansion or contraction. The result is that the flexure area bends and conventional bending sensors for the flexure area can sense the amount of bend. By comparing the actual amount of bend sensed with the amount expected from the temperature change applied to the beam, the operational capability can be determined.

REFERENCES:
patent: 3303452 (1967-02-01), Booth
patent: 4686440 (1987-08-01), Hatamura et al.
patent: 4750364 (1988-06-01), Kawamura et al.
patent: 4776924 (1988-10-01), Delapierre
patent: 4831304 (1989-05-01), Dorey et al.
patent: 4945769 (1990-08-01), Sidner et al.
patent: 5022272 (1991-06-01), Bronowicki et al.
patent: 5060504 (1991-10-01), White et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for thermally actuated self testing of sili does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for thermally actuated self testing of sili, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for thermally actuated self testing of sili will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2364604

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.